IVH substrate
We can manufacture various products such as BVH and COH by sequentially laminating the conductor layer onto the core material!
We would like to introduce the "IVH substrate" handled by Matsuwa Sangyo Co., Ltd. This is a multilayer printed circuit board that connects only the necessary interlayers (non-through vias) instead of using through vias. Unlike build-up substrates, it does not use laser vias and features the use of NC drills for all interlayer connections. By connecting multiple non-through holes in a multilayer board, it achieves greater freedom in wiring and increased wiring density. 【Example of IVH substrate manufacturing specifications】 ■ 0.4mm pitch BGA mounted 8-layer 6-stage continuous IVH substrate ・ IVH specifications: L1-2/1-3/1-4/1-5/1-6/1-7 IVH + L1-8 through ・ BGA pad diameter: φ0.3mm ・ Hole wall pattern spacing: 0.175mm ・ IVH drill diameter: L1-2/L1-3 = φ0.1mm, L1-4 to L1-7 = φ0.15mm * For more details, please refer to the related links or feel free to contact us.
- Company：松和産業 本社
- Price：Other
